News

posted on 09 June 2008 12:03

Hynix has developed a 3-layer MLC (multi-level cell) NAND flash cell cutting production costs by 30% and also shrinking chip size by 30%.

Hynix says it has a 32GBit triple-level cell ready to be mass-produced from October. It will think about using it in solid state drives (SSDs), presumably wanting to see if there is real demand and not just a flash in the pan (sorry).

A single level cell (SLC) flash component has one cell whose value can be either a binary one or zero. Current MLC components have two cells, doubling the capacity of the flash chip using a double level cell compared to a single layer one. The new Hynix MLC component has three cells, being a triple level cell, upping capacity over a double-layer cell by a third.

A manufacturer of 3-level flash has a production cost and capacity advantage over a manufacturer of 2-level flash.

More here.

^{[Chris Mellor.]}